| PART |
Description |
Maker |
| DBCPHC3532AG1 DBCPHC3510AG1 DBCPHC3504AG1 DBCPHC35 |
PIN HEADER DUAL ROW STRAIGHT SMT - 2.0MM
|
Dubilier
|
| 200115MS |
2.0mm DUAL ROW BOX HEADER P.C.B. MOUNT TYPE
|
SUYIN USA, INC.
|
| DBCPHC3702AG1 DBCPHC3703AG1 DBCPHC3704AG1 DBCPHC37 |
PIN HEADERS DUAL BODY DUAL ROW - 2.0MM
|
Dubilier
|
| 200136FA |
2.0mm DUAL ROW SOCKET SMD TYPE
|
SUYIN USA, INC.
|
| 1-1734493-2 1-1734493-4 4-1734493-8 4-1734493-6 4- |
AMPMODU 2.0mm PITCH, RIGHT ANGLE, DUAL ROW, THRU-HOLE
|
Tyco Electronics
|
| 200138FR |
2.0mm DUAL ROW SOCKET RIGHT ANGLE DIP TYPE W/O NUT
|
SUYIN USA, INC.
|
| 0554012619 55401-2619 |
2.54mm (.100) Pitch QF-50 Flat Ribbon Cable Header, Dual Row, Vertical Shrouded Header with Eject Levers, 26 Circuits, Lead-free
MOLEX Connector
|
Molex Electronics Ltd.
|
| 70280-0068 A-70280-0068 0010897562 010-89-7562 |
2.54mm (.100) Pitch C-Grid? Breakaway Header, Dual Row, Vertical, High Temperature, 56 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Dual Row, Vertical, High Temperature, 56 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating
2.54mm (.100") Pitch C-Grid垄莽 Breakaway Header, Dual Row, Vertical, High Temperature, 56 Circuits, 0.38楼矛m (15楼矛") Gold (Au) Selective Plating
|
Molex Electronics Ltd.
|
| 87914-2815 0879142815 |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 28 Circuits, 0.75μm (30μ) Gold (Au) Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 28 Circuits, 0.75渭m (30渭) Gold (Au) Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole, Dual Row, Vertical, 28 Circuits, 0.75楼矛m (30楼矛) Gold (Au) Plating, Tray Packaging, Lead-free
|
Molex Electronics Ltd.
|
| 87914-2216 0879142216 |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 22 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 22 Circuits, 2.50渭m (98.4渭) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole, Dual Row, Vertical, 22 Circuits, 2.50楼矛m (98.4楼矛) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
|
Molex Electronics Ltd.
|
| 0194280002 19428-0002 |
5.84mm (.230) Pitch MX150L Vertical PCB Header, Dual Row, Standard Profile, 16Circuits
5.84mm (.230") Pitch MX150L垄芒 Vertical PCB Header, Dual Row, Standard Profile, 16Circuits
MOLEX Connector
|
Molex Electronics Ltd.
|
|
